UV-Cure Adhesive · UV + Moisture Dual Cure
UV + Moisture Dual-Cure Encapsulant ZLA-7104
ZLA-7104 is a milky-white, one-component acrylic for encapsulating pins on flexible circuit boards and sealing small components.
At 20,000 mPa·s it is applied as a bead that stays in place; it sets in 15 seconds under 365 nm UV, and air moisture finishes the cure underneath and in shaded corners.
The cured bead is soft enough (Shore A 40) to cushion fragile pins and solder joints. It insulates very highly (10¹⁶ Ω·cm or more) and keeps humidity and corrosion away from the metal it covers.
The full technical data sheet for ZLA-7104 is available on request. Request the data sheet
Product specifications
| Property | Value | Condition / test method |
|---|---|---|
| Colour | Milky white | |
| Cure | UV + moisture | |
| Viscosity (mPa·s) | 20,000 | 25 °C |
| Density (g/cm³) | 1.2±0.2 | Test method: ASTM D792 |
| UV cure time (s) | 15 | 365 nm |
| Hardness (Shore A) | 40 | Test method: ASTM D2240 |
| Tensile strength (MPa) | 15 | Test method: ASTM D412 |
| Elongation at break (%) | 30 | Test method: ASTM D638 |
| Volume resistivity (Ω·cm) | ≥10¹⁶ | |
| Water absorption (%) | 0.5 | Test method: ASTM D570 |
| Flammability | V-0 | Test method: UL 94 |
- Colour
- Milky white
- Cure
- UV + moisture
- Viscosity (mPa·s)
- 20,000
- 25 °C
- Density (g/cm³)
- 1.2±0.2
- Test method: ASTM D792
- UV cure time (s)
- 15
- 365 nm
- Hardness (Shore A)
- 40
- Test method: ASTM D2240
- Tensile strength (MPa)
- 15
- Test method: ASTM D412
- Elongation at break (%)
- 30
- Test method: ASTM D638
- Volume resistivity (Ω·cm)
- ≥10¹⁶
- Water absorption (%)
- 0.5
- Test method: ASTM D570
- Flammability
- V-0
- Test method: UL 94
Typical values, not for specification. Confirm critical properties on your own parts before production.
Features
- Sets in 15 s under 365 nm UV; moisture cures shaded areas
- Thick bead (20,000 mPa·s) for encapsulating pins and components
- Very high insulation (10¹⁶ Ω·cm or more) and a barrier to humidity
- Soft cure (Shore A 40) that cushions pins and solder joints
- Rated V-0 to UL 94; RoHS compliant
Product applications
- Encapsulating small electronic components
- Covering pins and solder joints on flexible circuit boards
- Fast, insulating moisture protection on assemblies
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