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Epoxy Adhesive and Potting Compound · Flexible Epoxy Potting Compound

Two-Component Flexible Epoxy Potting Compound ZLA-6204

Two-Component Flexible Epoxy Potting Compound ZLA-6204 (illustration: pail)

ZLA-6204 is a 4:1 flexible epoxy potting compound that adds a modest heat path (0.4 W/m·K) to crack-resistant encapsulation.

It cures at room temperature or with heat and is tack-free in about 120 minutes, leaving time for larger pours, before reaching Shore A 80 with 7 MPa lap shear on aluminium.

Mixed density is 1.65±0.2 g/cm³, and heat-aged samples stayed crack-free (see the typical values).

The full technical data sheet for ZLA-6204 is available on request. Request the data sheet

Product specifications

Colour
A: Black; B: Transparent
System
Two-component
Cure
Room temperature or heat
Mix ratio (A:B)
4:1
Viscosity (mPa·s)
A: 4000; B: 260
25 °C
Density, mixed (g/cm³)
1.65±0.2
Test method: ASTM D792
Tack-free time (min)
120
25 °C
Hardness (Shore A)
80
Test method: ASTM D2240
Lap shear strength, aluminium (MPa)
7
Heat ageing
No cracks
80 °C, 500 h
Thermal conductivity (W/m·K)
0.4
Test method: ASTM D5470
Flammability
V-0
Test method: UL 94

Typical values, not for specification. Confirm critical properties on your own parts before production.

Features

  • 0.4 W/m·K thermal conductivity
  • 4:1 mix ratio
  • Tack-free in 120 min, for larger pours
  • Flexible, crack-resistant cure (Shore A 80)
  • Rated V-0 to UL 94; RoHS compliant

Product applications

  • Power supplies that run warm
  • Transformers that need some heat removed
  • Battery modules

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ZLA-6204 Two-Component Flexible Epoxy Potting Compound

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