Thermally Conductive Silicone Potting Compound
Thermally Conductive Silicone Potting Compound ZLA-4102
ZLA-4102 is a two-component silicone potting compound with a thermal conductivity of 0.5 W/m·K. It is the lightest grade of the range at 1.5 g/cm³ mixed, and its low viscosity lets it run into tight spaces around components.
Mixed 1:1, it cures at room temperature or with heat into a Shore A 55 silicone rubber that bonds to what it covers, seals it in and draws heat away.
Choose it when sealing and insulation come first and only modest heat has to be removed.
The full technical data sheet for ZLA-4102 is available on request. Request the data sheet
Product specifications
| Property | Value | Condition / test method |
|---|---|---|
| Colour | A: White; B: Black | |
| Mix ratio (A:B) | 1:1 | |
| Viscosity (mPa·s) | A: 1800; B: 2000 | 25 °C |
| Density, mixed (g/cm³) | 1.5±0.1 | Test method: ASTM D792 |
| Pot life (min) | >30 | |
| Hardness (Shore A) | 55±5 | Test method: ASTM D2240 |
| Thermal conductivity (W/m·K) | 0.5±0.05 | Test method: ASTM D5470 |
| Volume resistivity (Ω·cm) | >10¹² | Test method: ASTM D257 |
| Dielectric strength (kV/mm) | ≥10 | Test method: ASTM D149 |
| Flammability | V-0 | Test method: UL 94 |
| Service temperature (°C) | -50 to 200 |
- Colour
- A: White; B: Black
- Mix ratio (A:B)
- 1:1
- Viscosity (mPa·s)
- A: 1800; B: 2000
- 25 °C
- Density, mixed (g/cm³)
- 1.5±0.1
- Test method: ASTM D792
- Pot life (min)
- >30
- Hardness (Shore A)
- 55±5
- Test method: ASTM D2240
- Thermal conductivity (W/m·K)
- 0.5±0.05
- Test method: ASTM D5470
- Volume resistivity (Ω·cm)
- >10¹²
- Test method: ASTM D257
- Dielectric strength (kV/mm)
- ≥10
- Test method: ASTM D149
- Flammability
- V-0
- Test method: UL 94
- Service temperature (°C)
- -50 to 200
Typical values, not for specification, measured at 23 ± 2 °C and 50 ± 5 % RH. Confirm critical properties on your own parts before production.
Features
- 0.5 W/m·K thermal conductivity at the lowest density of the range
- 1:1 mix; cures at room temperature or with heat
- Bonds to the parts it encloses, so one pour seals, fixes and cools
- Insulating: volume resistivity above 10¹² Ω·cm, dielectric strength 10 kV/mm or more
- Rated V-0 to UL 94; service from -50 to 200 °C; RoHS compliant
Product applications
- Circuit boards that mainly need sealing and insulation
- Low-power supply modules
- Automotive electronic modules
- Junction boxes
Related products
Thermally Conductive Silicone Potting Compound
1.0 W/m·K · Shore A 45 · ≥ 15 kV/mm
ZLA-4104Thermally Conductive Silicone Potting Compound
2.0 W/m·K · Shore A 50 · 2.7 g/cm³
ZLA-4106Thermally Conductive Silicone Potting Compound
3.0 W/m·K · Shore A 55 · 3.0 g/cm³
ZLA-4108Thermally Conductive Silicone Potting Compound
4.0 W/m·K · Shore A 55 · 3.1 g/cm³
ZLA-4110
Get the right products at competitive prices for your business now
Request a quote from us now
Tell us what you need — a product code, the application or the quantity — and a Zennov specialist will contact you.
Zennov Industry Sdn Bhd
- A-5-9, Empire Tower, Jalan SS 16/147500 Subang Jaya, Selangor, Malaysia
- Phone: 03-2788 3585
- WhatsApp: +60 12-680 4098 (opens in a new tab)
- Fax: 03-2788 3690 (fax)
- E-mail: sales@zennov.com
We use the details you send only to answer your enquiry and keep a record of it, as described in our Privacy Policy.