Thermally Conductive Silicone Potting Compound
Thermally Conductive Silicone Potting Compound ZLA-4108
ZLA-4108 is a two-component silicone potting compound rated at 3.0 W/m·K, for power electronics that run hot and still have to be fully sealed.
The 1:1 mix cures at room temperature or with heat into a Shore A 55 rubber that bonds to the parts, seals them in and conducts their heat to the housing.
Mixed density is 3.0 g/cm³; if weight matters more than heat, compare it with the 2.0 W/m·K grade.
The full technical data sheet for ZLA-4108 is available on request. Request the data sheet
Product specifications
| Property | Value | Condition / test method |
|---|---|---|
| Colour | A: Green; B: White | |
| Mix ratio (A:B) | 1:1 | |
| Viscosity (mPa·s) | A: 7000; B: 8000 | 25 °C |
| Density, mixed (g/cm³) | 3.0±0.1 | Test method: ASTM D792 |
| Pot life (min) | >30 | |
| Full cure (h) | 24 | room temperature |
| Hardness (Shore A) | 55±5 | Test method: ASTM D2240 |
| Thermal conductivity (W/m·K) | 3.0±0.3 | Test method: ASTM D5470 |
| Volume resistivity (Ω·cm) | >10¹² | Test method: ASTM D257 |
| Dielectric strength (kV/mm) | ≥12 | Test method: ASTM D149 |
| Dielectric constant | <7 | 1 MHz · Test method: ASTM D150 |
| Flammability | V-0 | Test method: UL 94 |
| Service temperature (°C) | -50 to 200 |
- Colour
- A: Green; B: White
- Mix ratio (A:B)
- 1:1
- Viscosity (mPa·s)
- A: 7000; B: 8000
- 25 °C
- Density, mixed (g/cm³)
- 3.0±0.1
- Test method: ASTM D792
- Pot life (min)
- >30
- Full cure (h)
- 24
- room temperature
- Hardness (Shore A)
- 55±5
- Test method: ASTM D2240
- Thermal conductivity (W/m·K)
- 3.0±0.3
- Test method: ASTM D5470
- Volume resistivity (Ω·cm)
- >10¹²
- Test method: ASTM D257
- Dielectric strength (kV/mm)
- ≥12
- Test method: ASTM D149
- Dielectric constant
- <7
- 1 MHz · Test method: ASTM D150
- Flammability
- V-0
- Test method: UL 94
- Service temperature (°C)
- -50 to 200
Typical values, not for specification, measured at 23 ± 2 °C and 50 ± 5 % RH. Confirm critical properties on your own parts before production.
Features
- 3.0 W/m·K thermal conductivity
- Shore A 55 cure; bonds, seals and conducts in one pour
- Dielectric strength 12 kV/mm or more; volume resistivity above 10¹² Ω·cm
- 1:1 mix; room-temperature or heat cure
- Rated V-0 to UL 94; service from -50 to 200 °C; RoHS compliant
Product applications
- Power modules that run hot and must stay fully sealed
- Automotive electronic modules
- Power conversion equipment with high heat loads
Related products
Thermally Conductive Silicone Potting Compound
4.0 W/m·K · Shore A 55 · 3.1 g/cm³
ZLA-4110Thermally Conductive Silicone Potting Compound
2.0 W/m·K · Shore A 50 · 2.7 g/cm³
ZLA-4106Thermally Conductive Silicone Potting Compound
1.0 W/m·K · Shore A 45 · ≥ 15 kV/mm
ZLA-4104Thermally Conductive Silicone Potting Compound
0.5 W/m·K · Shore A 55 · 1.5 g/cm³
ZLA-4102
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