Thermally Conductive Silicone Potting Compound
Thermally Conductive Silicone Potting Compound ZLA-4106
ZLA-4106 doubles the thermal conductivity of the general grade to 2.0 W/m·K, for modules where heat has started to limit the design.
Mixed 1:1, it cures at room temperature or with heat into a Shore A 50 rubber that bonds to the components, seals them in and moves their heat to the enclosure.
Allow for the higher density (2.7 g/cm³) when you work out fill weights.
The full technical data sheet for ZLA-4106 is available on request. Request the data sheet
Product specifications
| Property | Value | Condition / test method |
|---|---|---|
| Colour | A: Orange; B: White | |
| Mix ratio (A:B) | 1:1 | |
| Viscosity (mPa·s) | A: 7000; B: 7500 | 25 °C |
| Density, mixed (g/cm³) | 2.7±0.1 | Test method: ASTM D792 |
| Pot life (min) | >30 | |
| Full cure (h) | 24 | room temperature |
| Hardness (Shore A) | 50±5 | Test method: ASTM D2240 |
| Thermal conductivity (W/m·K) | 2.0±0.2 | Test method: ASTM D5470 |
| Volume resistivity (Ω·cm) | >10¹² | Test method: ASTM D257 |
| Dielectric strength (kV/mm) | ≥13 | Test method: ASTM D149 |
| Dielectric constant | <7 | 1 MHz · Test method: ASTM D150 |
| Flammability | V-0 | Test method: UL 94 |
| Service temperature (°C) | -50 to 200 |
- Colour
- A: Orange; B: White
- Mix ratio (A:B)
- 1:1
- Viscosity (mPa·s)
- A: 7000; B: 7500
- 25 °C
- Density, mixed (g/cm³)
- 2.7±0.1
- Test method: ASTM D792
- Pot life (min)
- >30
- Full cure (h)
- 24
- room temperature
- Hardness (Shore A)
- 50±5
- Test method: ASTM D2240
- Thermal conductivity (W/m·K)
- 2.0±0.2
- Test method: ASTM D5470
- Volume resistivity (Ω·cm)
- >10¹²
- Test method: ASTM D257
- Dielectric strength (kV/mm)
- ≥13
- Test method: ASTM D149
- Dielectric constant
- <7
- 1 MHz · Test method: ASTM D150
- Flammability
- V-0
- Test method: UL 94
- Service temperature (°C)
- -50 to 200
Typical values, not for specification, measured at 23 ± 2 °C and 50 ± 5 % RH. Confirm critical properties on your own parts before production.
Features
- 2.0 W/m·K thermal conductivity
- Shore A 50 cure that bonds and seals as well as cooling
- Dielectric strength 13 kV/mm or more; dielectric constant below 7 at 1 MHz
- 1:1 mix; room-temperature or heat cure
- Rated V-0 to UL 94; service from -50 to 200 °C; RoHS compliant
Product applications
- Denser power supply boards where heat limits the layout
- Automotive electronic modules with higher heat loads
- Inverters and other power conversion equipment
Related products
Thermally Conductive Silicone Potting Compound
3.0 W/m·K · Shore A 55 · 3.0 g/cm³
ZLA-4108Thermally Conductive Silicone Potting Compound
1.0 W/m·K · Shore A 45 · ≥ 15 kV/mm
ZLA-4104Thermally Conductive Silicone Potting Compound
4.0 W/m·K · Shore A 55 · 3.1 g/cm³
ZLA-4110Thermally Conductive Silicone Potting Compound
0.5 W/m·K · Shore A 55 · 1.5 g/cm³
ZLA-4102
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